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ETA's December News
  
In this Issue:
SAEETA a Finalist in SAE Detroit Section/MITEF Vehicle Innovation Competition 

 

ACP LogoETA was selected as one of the four finalists for its advanced engineering service, the Accelerated Concept to Product (ACP) Process, in the 2nd Annual SAE Detroit Section/MITEF Vehicle Innovation Competition.  The competition selects inventions that provide innovative solutions to current automotive industry challenges.  The finals will be held on Monday, December 7th, 2009 at the San Marino Club in Troy, MI.    

The competition was started by the SAE Detroit Section, in concert with MIT Entrepreneurial Forum (MITEF).  It will offer its member engineers a chance to meet ETA and the other three finalists.  The event will have an exciting, thought-provoking program, and all are encouraged to attend.

ETA will highlight the main objectives of its ACP Process at the event, including reducing the product development time/cost, reducing product mass and improving product performance.  In addition to these main objectives, ACP addresses many additional product development and manufacturing concerns and provides solutions to create better performing products at a lower cost.  For more information regarding ACP, please go to
www.eta.com/images/CAE-SS.pdf.  

The Social Hour will begin at 5:15 p.m., followed by the Presentations / Q&A from 6:15 - 8:00 p.m. Additional networking will immediately follow the presentations from 8:00 - 8:30 p.m. The cost to attend is $20 for SAE and MITEF members, $35 for non-members and $15 for student members.

For more information, please visit:
http://www.sae-detroit.org/events.aspx.
 
DYNAFORM displayfabtechDYNAFORM Selected
Best of Trade Show
 
DYNAFORM was selected as a "Best of Trade Show" winner for Fabtech/Metalform 2009.  The honor marked ETA and DYNAFORM as one of the "hottest companies, products, services and thought leaders being featured at the show".  To listen to a podcast regarding DYNAFORM, please visit: http://www.bestoftradeshow.com/fabtech_2009.php.
  
bse-in-nxProduct Spotlight - BSE-in-NX 
NX Logo
Blank, nest and process quotations from the 3D part geometry in minutes  with BSE-in-NX.  Data translation is not required.  This module is a complete solution for accurately estimating blank size, along with blank nesting for maximum material usage, scrap and piece price all within the NX environment.  It also incorporates the accurate FEA solver, LS-DYNA, for formability simulation. For more information, click Thickness Maphere.
  • Blank Size Estimation
  • Blank Nesting
  • Quotation Generation
  • FEA Analysis
  • Accurate Reporting Results 
TrainingUpcoming Training Sessions
 
Please join us for one of our upcoming training sessions. To register, please visit: www.eta.com.  

training

December 8th
January 12th

Introduction to LS-DYNA®
December 9th, 10th
January 13th, 14th 

Introduction to DYNAFORM
January 5th, 6th 
Downloaddynaform5.7DYNAFORM 5.7.1 Released 

ETA's is pleased to announce the release of DYNAFORM 5.7.1. The version is now available online by going to ETA Downloads.  

In this particular release, ETA's team has implemented more than 70 enhancements and new functions in the BSE, DFE and Formability modules, as well as for Pre- and Post-Processing functions.  For a complete list of improvements, please visit:  http://www.eta.com/content/view/128/1/.

  

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Engineering Technology Associates, Inc. | 1133 E. Maple Rd. | Troy | MI | 48083