Troy, MI (November 19, 2012) – Engineering Technology Associates, Inc. (ETA) announced the release of DYNAFORM™ Version 5.9 today. In the new version, a brand new module, incorporating optimization, has been unveiled.  The Optimization Platform (OP) makes DYNAFORM™ the most complete and powerful solution on the market for die system simulation and optimization.

 

ETA has embedded Red Cedar’s proprietary optimization technology, SHERPA, into the OP module.  The module is focused on supporting optimization of drawbead forces along with binder pressure, lubrication, gage, and material. 

 

Using the newest optimization technology, the OP module reduces product development time and cost for manufacturing by reducing incidents of wrinkling, thinning and tearing with limited effort. The OP guided user interface makes optimization viable for a larger set of users, since special optimization expertise is not required.  Additionally, the latest computing platforms combined with an efficient solver eliminate demanding computing requirements.  The solver is an incremental solution (INCSolver) that delivers exceptional speed, taking advantage of Shared Memory Processing (SMP) computing technology on multiple core machines running Windows 7 and beyond. 

 

“This solution will allow quick and accurate optimization of die face design, saving critical product development time, said Arthur Tang, Vice President of ETA. “For many years, tooling engineers have used DYNAFORM™ as a virtual tryout for metal stamping.  Now, engineers can go beyond identifying problem areas by incorporating design optimization to improve performance and quality - removing wrinkles and cracks.”

 

The OP module will use the same common interface as the other four modules of DYNAFORM™ that include Blank Size Engineering (BSE), Die Face Engineering (DFE), Formability Simulation (FS), and Die System Analysis (DSA).  Each of the four previously available modules has also been enhanced in the Version 5.9 software release.

 

Complete DYNAFORM Version 5.9 Release Notes, are now available online at http://www.eta.com/phocadownload/DYNAFORM59Release 

 

About Engineering Technology Associates, Inc. 


Engineering Technology Associates, Inc. (ETA) was established in 1983 by advanced product development engineers working as structural analysts for the world’s largest automotive manufacturers.  ETA’s expertise in the areas of vehicle durability, NVH, metal forming, crashworthiness, occupant safety and product design have provided an intimate knowledge of the challenges and needs of the product development engineer.  Proactive in the creation and implementation of new analysis methods and software, ETA is the developer of the Inventium Suite™, an enterprise product development solution that includes DYNAFORM™. For more information, please email This email address is being protected from spambots. You need JavaScript enabled to view it. or call (248) 729-3010.

 

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