Accelerate Sheet Metal Stamping with Dynaform: A Complete Virtual Die Development Solution
August 21 @ 2:00 pm - 3:00 pm
Free
Join us for a comprehensive webinar showcasing Dynaform, which was developed in the 1990s and is an industry-leading solution for virtual die development in sheet metal stamping developed by ETA. ETA is an engineering company, serving the automotive industry for more than 4 decades with engineering design and development and with our homegrown software Dynaform.
This session will walk through the full suite of Dynaform modules designed to optimize the stamping process from concept to production. Whether you’re involved in early feasibility studies or final tool validation, this webinar will provide valuable insights into improving efficiency, reducing physical tryouts, and lowering tooling costs. We’ll explore how engineers and tool designers can leverage Dynaform’s capabilities in:
• Blank Size Engineering for accurate cost estimation and material planning
• Die Face Design for quick feasibility analysis using a newer and faster solver with similar accuracy
• Formability Simulation to predict and mitigate potential defects
• Springback Compensation to ensure geometric accuracy
• Trim Line Development for precise edge prediction
• Die Structure Analysis for evaluating tool strength and durability
• Tube Bending and Hot Forming processes for advanced applications.
Who Should Attend: CAE analysts, tool & die engineers, manufacturing planners, and anyone involved in sheet metal part development.
Speakers
Ming Zhang
Tooling & CAE Specialist·ETA
Contact us
Our team of CAE experts are ready to discuss your needs and how we can help solve your problems through the right product, our engineering services, or in-client resources.
or call us at 1-248-729-3010
Ming Zhang is a tooling and CAE expert with over a decade of experience in virtual die development and sheet metal forming simulation. A graduate of Michigan State University, Ming has been with Engineering Technology Associates (ETA) since 2013, where he has played a key role in supporting the deployment and advancement of Dynaform. With a strong foundation in general CAE—including crash modeling and structural analysis—Ming brings a holistic engineering perspective to stamping simulation. He has been closely associated with Dynaform for more than 10 years, providing training, live demos, technical support, and both pre- and post-sales consultation to customers across automotive, aerospace, and appliance sectors. Ming’s expertise helps manufacturers reduce tooling lead times, cut costs, and improve stamping quality through virtual validation and process optimization.